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FPGA-based SmartNIC Hardware for
Capture, Inline, Virtualization and Programmable

Product Overview

In a world of reconfigurable computing, it is the software that defines the use case functionality. However, the wrong choice of hardware can severely downgrade the overall value and reliability of the solution.

Napatech SmartNICs are designed to meet the standards of modern servers, with the rapidly changing world of data center and hyperscale deployments in mind.

Industry-Leading Reliability
When selecting a hardware solution, reliability is of the utmost importance. Software can be patched if faulty, but hardware needs a physical replacement, which is costly and complex.

For all Napatech designs, performance and reliability are unconditional tenets. With ~300,000 hours of mean time between failures (MTBF), our hardware ensures uninterrupted, error-free operation for many years ahead – as validated by our long-term loyal customer base.

Superior Thermal Design
The power of FPGA technology is only of value if it can be harnessed – and that requires cooling. An efficient cooling solution allows you to fit more compute power into your rack space, which translates into substantial TCO benefits.

Napatech SmartNICs are designed with active and passive cooling. The active solution provides 100% self- contained cooling with no requirements for a specific server airflow. This solution exhales most of the dissipated energy outside the server through front plate cutouts, which gives customers the freedom to choose server designs without worrying about cooling capacity.

To meet telco requirements, the passively cooled solutions are NEBS-compliant. A proprietary full body heatsink has been developed securing optimal cooling performance in the challenging NEBS applications for all critical components in the SmartNIC.

Hardware Resilience
Modern servers have quick-release PCI fastening mechanisms that allow for easy card replacement. Some of these designs, however, expose the card to vibration during transportation. Napatech SmartNICs are designed specifically to ensure hardware resilience in this environment.

Standards of Excellence
Network appliances often require exceptions and compromises to fit a certain form factor or price point. In complex data center environments, it is therefore extremely beneficial if the hardware adheres to established industry standards, as this will make it easier for customers to integrate it in their solution.

As a certified PCI-SIG member, Napatech has completed the meticulous compliance test, which demonstrates our high standards of excellence.

Typical Applications
Napatech offers a range of FPGA software options for the SmartNIC hardware, addressing use cases within:

• Cybersecurity
• Network quality of experience assurance
• Network & security forensics
• Application performance management
• Network test & measurement
• Cyber defense
• vSwitch acceleration
• Virtual network monitoring

SmartNIC Products for COTS Servers nt40e3-4-ptp-product-overview nt40e3-4-ptp-product-overview nt200a01-product-overview nt200a01-product-overview nt200a01-product-overview
Model NT20E3-2 NT40E3-4
NT40A01
NT50B01 NT100A01 NT200D01 NT200A02
General Hardware Specifications            
Height Full Full Half Full Full Full
Length Half Half Half Half Half Half
FPGA technology XC7VX330T XC7VX330T NT100A01 XCVU5P S10 GX 2800 XCVU5P
XCVU7P[1]
XCVU9P[1]
SDRAM DDR3 DDR3 DDR4 DDR4 DDR4 DDR4
– Density 4 GB 4 GB 10 GB
20 GB[1]
8 GB
16 GB[1]
12 GB
24 GB[1]
12 GB
24 GB[1]
– Bandwidth 120 Gbps 120 Gbps 427 Gbps 341 Gbps 512 Gbps 512 Gbps
– Number of memory controllers 1 1 2 2 3 3
QSPI Flash memory 2×128 Mbit 2×128 Mbit 2×512 Mbit 2×512 Mbit 2×1 Gbit 2×512 Mbit
PCIe configuration PCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
Network Ports and Link Speeds            
Network ports 2xSFP+ 4xSFP+ 2xSFP28 4×SFP28 2xQSFP28 2xQSFP28
1G [2] [3] [3]
10G [2] [3] [3]
25G [2]     [3] [3]
40G [2]        
50G [2]         [4] [4]
100G [2]        
Time Synchronization Ports [2]            
Tyco Mini female for RJ45-F/ SMA-F adapter (on PCI bracket)        
2 x internal MCX-F for PPS and NT-TS  
RJ45-F for 100/1000BASE-T IEEE1588 PTP (on PCI bracket)      
SMA-F for PPS (on PCI bracket)     [1]
Time Synchronization Support            
Stratum 3E compliant TCXO [1]
SyncE frequency synch support [2]  
High-Speed Interconnect Port [2]            
Maximum bidirectional bandwith 180 Gbps 180 Gbps 900 Gbps 900 Gbps   900 Gbps
Hardware Board Monitoring            
FPGA temperature
Pluggable module temperature
Ambient temperature
Power sensors
Power and Cooling            
Cooling solution Active Active Passive Active Active Active
Max. power dissipation [5] 45 W 45 W 55 W 75 W 105 W 95 W
Idle power dissipation [5] 10 W 10 W 10 W 10 W 15 W 15 W
Airflow requirement None None >= 2.5 m/s None None None
General Hardware Properties            
Operating temperature 0°C to 45°C (32°F to 113°F)
Operating humidity 20% to 80%
MTBF (hours) 297,993 297,993   317,821   317,821
Weight 260 g 260 g   355 g   355 g
Regulatory compliance (common) PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance (product specific) KCC KCC KCC[1] KCC[1] KCC[1] KCC[1]

[1] On demand
[2] Features depend on software support, please refer to product briefs for Link™ Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload

SmartNIC Products NEBS-Compliant nt20e3-2-ptp-nebs-product-overview nt40e3-4-ptp-nebs-product-overview nt200a01-nebs-product-overview nt200a01-nebs-product-overview nt200a01-nebs-product-overview
Model NT20E3-2 NT40E3-4
NT40A01
NT50B01 NT100A01 NT200D01 NT200A02
General Hardware Specifications            
Height Full Full Half Full Full Full
Length Half Half Half Half Half Half
FPGA technology XC7VX330T XC7VX330T XCKU15P XCVU5P S10 GX 2800 XCVU5P
XCVU7P[1]
XCVU9P[1]
SDRAM DDR3 DDR3 DDR4 DDR4 DDR4 DDR4
– Density 4 GB 4 GB 10 GB
20 GB[1]
8 GB
16 GB[1]
12 GB
24 GB[1]
12 GB
24 GB[1]
– Bandwidth 120 Gbps 120 Gbps 240 Gbps 341 Gbps 460 Gbps 512 Gbps
– Number of memory controllers 1 1 2 2 3 3
QSPI Flash memory 2×128 Mbit 2×128 Mbit 2×512 Mbit 2×512 Mbit 2×1 Gbit 2×512 Mbit
PCIe configuration PCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
Network Ports and Link Speeds            
Network ports 2xSFP+ 4xSFP+ 2xSFP28 4xSFP28 2xQSFP28 2xQSFP28
1G [2]  • [3] [3]
10G [2] [3] [3]
25G [2]     [3] [3]
40G [2]        
50G [2]         [4] [4]
100G [2]        
Time Synchronization Ports [2]            
Tyco Mini female for RJ45-F/ SMA-F adapter (on PCI bracket)        
2 x internal MCX-F for PPS and NT-TS  
RJ45-F for 100/1000BASE-T IEEE1588 PTP (on PCI bracket)      
SMA-F for PPS (on PCI bracket)     [1]
Time Synchronization Support            
Stratum 3E compliant TCXO [1]
SyncE frequency synch support [2]    
High-Speed Interconnect Port [2]            
Maximum bidirectional bandwidth 180 Gbps 180 Gbps 900 Gbps 900 Gbps   900 Gbps
Hardware Board Monitoring            
FPGA temperature
Pluggable module temperature
Ambient temperature
Power sensors
Power and Cooling            
Cooling solution Passive Passive Passive Passive Passive Passive
Max. power dissipation [5] 45 W 45 W 55 W 75 W 105 W 95 W
Idle power dissipation [5] 10 W 10 W 10 W 15 W 15 W 15 W
Airflow requirement >= 2.5 m/s >= 2.5 m/s >= 3.5 m/s >= 2.5 m/s >= 2.5 m/s >= 2.5 m/s
General Hardware Properties            
Operating temperature –5°C to 55°C (23°F to 131°F)
Operating humidity 5% to 85%
MTBF (hours) 367,807 367,807 991,182 398,565   398,565
Weight 260 g 260 g 350 g 350 g   355 g
Regulatory compliance (common) PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance (product specific) KCC KCC KCC[1] KCC[1] KCC[1] KCC[1]

[1] On demand
[2] Features depend on software support, please refer to product briefs for Link™ Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload

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