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Napatech Link SmartNICs
for Reconfigurable Computing

Product Overview

In a world of Reconfigurable Computing it is the software that defines the use case functionality, but the wrong choice of hardware can seriously limit the overall benefits and reliability of the solution.

Napatech’s Link SmartNICs are designed to meet all the standards of modern servers, and with a rapidly changing world of Data Center and hyperscale deployments in mind.

PEACE OF MIND
The first thing on everybody’s mind when selecting a hardware solution is the question of reliability. Software can be patched if faulty, but hardware needs a physical replacement. You need to get it right the first time!

When Napatech is designing hardware, reliability is first and foremost in everything we do. Our customers need solutions that will support their use cases without worry. Our long-term loyal customer base proves this point.

KEEP YOUR COOL
The power of FPGA technology is only available if you can harness the power, and that takes cooling! In simple terms: The more you can cool, the more power you can burn, and the more functionality you can run on your Link SmartNIC. This translates into real economical benefits, as you can fit more compute power into server rack space with a good cooling solution.

Napatech designs Link SmartNICs with both active and passive cooling. The actively cooled solutions provide a 100% self-contained cooling solution with NO requirements for a specific server airflow. This solution exhales the majority of dissipated energy outside the server through front plate cutouts. This means that customers have the freedom to choose server designs without worrying about cooling capacity. To meet telecom requirements, the passively cooled solutions are NEBS-compliant.

KEEP YOUR COOL
The power of FPGA technology is only available if you can harness the power, and that takes cooling! In simple terms: The more you can cool, the more power you can burn, and the more functionality you can run on your Link SmartNIC. This translates into real economical benefits, as you can fit more compute power into server rack space with a good cooling solution.

Napatech designs Link SmartNICs with both active and passive cooling. The actively cooled solutions provide a 100% self-contained cooling solution with NO requirements for a specific server airflow. This solution exhales the majority of dissipated energy outside the server through front plate cutouts. This means that customers have the freedom to choose server designs without worrying about cooling capacity. To meet telecom requirements, the passively cooled solutions are NEBS-compliant.

GOOD VIBRATIONS
Modern servers have quick release PCI fastening mechanisms that allow for easy change of Link SmartNICs. Unfortunately, some of these designs are exposing PCI cards to vibration in the slot during transportation. To make sure that the hardware survives this environment, Napatech hardware is designed to meet the highest standards.

STANDARDS OF EXCELLENCE
Understanding the in’s and out’s of modern servers starts with the standards, but continues into tackling the hard realities of compromises and exceptions made to fit a certain form factor or price point. The more the SmartNIC hardware adhere to established industry standards, the easier it will be for customers to integrate it in their solution.

Napatech is on the PCI-SIG integrators list as a testimony to Napatech’s efforts to make sure that our customers do not need to worry about the hardware, and can focus on their software solution.

LINK TO THE FUTURE
Napatech offers a whole range of FPGA software options for the Link hardware, that address use cases within:
• Network Security
• Network Quality of Experience Assurance
• Network & Security Forensics
• Application Performance Management (APM)
• Network Test & Measurement
• Cyber Defense
• vSwitch Acceleration
• Virtual Network Monitoring

Link SmartNIC Products for COTS Serversnt40e3-4-ptp-product-overviewnt40e3-4-ptp-product-overviewnt80e3-2-ptp-product-overviewnt100e3-1-ptp-product-overviewnt200a01-product-overviewnt200a01-product-overview
ModelNT20E3-2NT40E3-4
NT40A01
NT80E3-2NT100E3-1NT200A01NT200A02
General Hardware Specifications
HeightFullFullFullFullFullFull
LengthHalfHalf3/43/4HalfHalf
FPGA technologyXC7VX330TXC7VX330TXC7VX690TXC7VX690TXCVU095XCVU5P
SDRAMDDR3DDR3DDR3DDR3DDR4DDR4
– Density4 GB4 GB8 GB8 GB12 GB12 GB
– Bandwidth120 Gbps120 Gbps240 Gbps240 Gbps460 Gbps512 Gbps
– Number of memory controllers112233
PCIe configurationPCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
2 × 8 lanes
@ 8 GT/s [1]
PCIe Gen3
16 lanes
@ 8 GT/s
Network Ports and Link Speeds
Network ports2xSFP+4xSFP+2xQSFP+1xCFP42xQSFP282xQSFP28
1G• (breakout)• (breakout)• (breakout)
10G• (breakout)• (breakout)• (breakout)
25G• (breakout)• (breakout)
40G• (breakout)
50G• (breakout)• (breakout)
100G
Time Synchronization Ports
Tyco Mini female for RJ45-F/ SMA-F adapter (on PCI bracket)
2 x internal MCX-F for PPS and NT-TS
2 x internal MCX-F for NT-TS2
RJ45-F for 100/1000BASE-T IEEE1588 PTP (on PCI bracket)
SMA-F for PPS (on PCI bracket)
Time Synchronization Support
Stratum 3E compliant TCXO
SyncE frequency synch support
High-Speed Interconnect Port
Maximum bandwith89 Gbps89 Gbps112 Gbps112 Gbps309 Gbps393 Gbps
Hardware Board Monitoring
FPGA temperature
Pluggable module temperature
Ambient temperature
Power sensors
Power and Cooling
Cooling solutionActiveActiveActiveActiveActiveActive
Max. power dissipation [2]45 W45 W85 W85 W95 W95 W
Idle power dissipation [2]10 W10 W15 W15 W15 W15 W
Airflow requirementNoneNoneNoneNoneNoneNone
General Hardware Properties
Operating temperature0°C to 45°C (32°F to 113°F)
Operating humidity20% to 80%
MTBF (hours)297,993297,993263,546259,880317,821317,821
Weight260 g260 g455 g455 g355 g355 g
Regulatory compliance (common)PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance (product specific)KCCKCCKCC

[1] Requires bifurcation support from the server
[2] The max and idle power dissipation values indicate the capabilities of the hardware platform. The actual power consumption is dependent on the FPGA software payload.

Link SmartNIC Products NEBS-Compliantnt20e3-2-ptp-nebs-product-overviewnt40e3-4-ptp-nebs-product-overviewnt80e3-2-ptp-nebs-product-overviewnt100e3-1-ptp-nebs-product-overviewnt200a01-nebs-product-overviewnt200a01-nebs-product-overview
ModelNT20E3-2NT40E3-4
NT40A01
NT80E3-2NT100E3-1NT200A01NT200A02
General Hardware Specifications
HeightFullFullFullFullFullFull
LengthHalfHalf3/43/4HalfHalf
FPGA technologyXC7VX330TXC7VX330TXC7VX690TXC7VX690TXCVU095XCVU5P
SDRAMDDR3DDR3DDR3DDR3DDR4DDR4
– Density4 GB4 GB8 GB8 GB12 GB12 GB
– Bandwidth120 Gbps120 Gbps240 Gbps240 Gbps460 Gbps512 Gbps
– Number of memory controllers112233
PCIe configurationPCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
8 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
16 lanes
@ 8 GT/s
PCIe Gen3
2 × 8 lanes
@ 8 GT/s [1]
PCIe Gen3
16 lanes
@ 8 GT/s
Network Ports and Link Speeds
Network ports2xSFP+4xSFP+2xQSFP+1xCFP42xQSFP282xQSFP28
1G• (breakout)• (breakout)• (breakout)
10G• (breakout)• (breakout)• (breakout)
25G• (breakout)• (breakout)
40G• (breakout)
50G• (breakout)• (breakout)
100G
Time Synchronization Ports
Tyco Mini female for RJ45-F/ SMA-F adapter (on PCI bracket)
2 x internal MCX-F for PPS and NT-TS
2 x internal MCX-F for NT-TS2
RJ45-F for 100/1000BASE-T IEEE1588 PTP (on PCI bracket)
SMA-F for PPS (on PCI bracket)
Time Synchronization Support
Stratum 3E compliant TCXO
SyncE frequency synch support
High-Speed Interconnect Port
Maximum bandwith89 Gbps89 Gbps112 Gbps112 Gbps309 Gbps393 Gbps
Hardware Board Monitoring
FPGA temperature
Pluggable module temperature
Ambient temperature
Power sensors
Power and Cooling
Cooling solutionPassivePassivePassivePassivePassivePassive
Max. power dissipation [2]45 W45 W85 W85 W95 W95 W
Idle power dissipation [2]10 W10 W15 W15 W15 W15 W
Airflow requirement>= 2.5 m/s>= 2.5 m/s>= 2.5 m/s>= 2.5 m/s>= 2.5 m/s>= 2.5 m/s
General Hardware Properties
Operating temperature–5°C to 55°C (23°F to 131°F)
Operating humidity5% to 85%
MTBF (hours)297,993297,993263,546259,880317,821317,821
Weight260 g260 g455 g455 g355 g355 g
Regulatory compliance (common)PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance (product specific)KCCKCCKCC

[1] Requires bifurcation support from the server
[2] The max and idle power dissipation values indicate the capabilities of the hardware platform. The actual power consumption is dependent on the FPGA software payload.

Explore Napatech FPGA SmartNICs

Our products capture data at high speed with zero packet loss, enabling you to have real-time insight into network traffic.

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