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main Engineered for High Performance Computing Link™ Programmable Link™ Programmable provides an industry-proven, ultra-reliable platform for OEMs and end users to deploy their own custom apps and software based on industry-standard tools.

Leveraging Napatech’s industry-proven hardware, Link™ Programmable provides OEMs and end users with a solid platform for deploying their own custom FPGA computation solutions.

Open Standard Servers

Peak performance at minimal cost

Ethernet Front Port Compliance

Error-free uninterrupted operation

Event Handling & System Monitoring

Seamless integration – maximized uptime

Thermal Performance

Optimized rack-space utilization

Regulatory Compliance

Quick integration with no delays

Shock & Vibration Robustness

Strong resilience to rough environments

PCI Compliance

Proven uncompromising quality

Rivaling clustered HPC at a fraction of the cost

Link™ Programmable brings massive parallel processing capacity to compute intensive applications. The hardware is designed to accommodate thermal and slot-size constraints, enabling 8+ cards to sit adjacent in a single COTS server. Through ultra-highspeed interconnects, the cards can distribute workloads across FPGAs, providing parallel processing capacity comparable to clustered high performance computing (HPC) solutions at a fraction of the cost.

Powered by Xilinx UltraScale+ FPGA

FPGA solutions for compute acceleration can enable up to 90x higher performance compared to CPUs, and over 4x higher inference throughput than GPU-based solutions.

Built on the Xilinx 16nm UltraScale+™ architecture, the Link™ Programmable flagship card pushes the Xilinx 3rd generation FPGA to its maximum, enabling highest signal processing and serial I/O bandwidth to satisfy the most demanding design requirements.

Link™ Programmable is ideal for compute intensive applications ranging from 1+ terabit/second networking, computer vision, ultra-low latency high-frequency trading to cryptocoin mining.

The platform is fully supported by the Xilinx Vivado® design suite for rapid prototyping and product maturing. It is flexible and can be configured with various types of memory banks and FPGA chips, e.g. XCVU7P or XCVU9P.

Link™ NT200A02-SCC 8x10G, 2×10/25G, 2x40G, 2x100G

Ruggedized and industry-proven hardware

Meticulously designed, validated and compliance-tested to minimize integration risks in the server environment, Link™ Programmable enables OEMs and end users to focus their efforts on the target application, removing complexity and uncertainty from the integration process.

With ~300,000 hours of mean time between failures (MTBF), our hardware ensures uninterrupted,
error-free operation for many years ahead – as validated by our long-term loyal customer base.

Link™ Programmable Deployment Kit

A Deployment Kit is available for the Link™ Programmable family, containing:

• Interface cables necessary to program the hardware using a Xilinx Vivado® Probe

• A comprehensive hardware manual

• Xilinx Vivado® pinout files

• Xilinx example design images (PCIe, QSFP, DDR)

Through the Xilinx Vivado® design suite, FPGA developers can use a mix of Verilog/VHDL, C, C++ or SystemC for faster path to IP creation. Read more at Xilinx Vivado®

Napatech NT200A02 features:

Time Syncing Anywhere We support nanosecond time synchronization between multiple applications in multiple locations, worldwide. Rigid Housing The black molded encapsulation adds rigidity to the structure and gives our FPGA SmartNICs unmatched robustness. It also helps control the airflow, and thus the temperature, of the SmartNIC. Double Cooling To generate and control our airflow, we designed a blower that can take in air from the top and the bottom of the SmartNIC. This doubles the amount of air that can be channeled through the product, ensuring superior cooling. Time Syncing Within an Appliance We offer the ability to time synchronize multiple FPGA SmartNICs with nanosecond precision within the same appliance. High-Speed Interconnect Ports To accommodate multiple SmartNICs in a single COTS server, all Napatech designs include high-speed interconnect ports. Heat Exhausts The carefully designed exhausts on the front of the SmartNIC ensure that the warm air exits the SmartNIC without increasing the temperature within the appliance or server housing.
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Time Syncing Anywhere We support nanosecond accurate time synchronization between multiple applications in multiple locations, no matter where they are located in the world. Rigid Housing The black molded encapsulation adds rigidity to the structure and gives our FPGA SmartNICs unmatched robustness. It also helps control airflow, and thus the temperature, of the SmartNIC. Double Cooling To generate and control our airflow, we designed a blower that can take in air from the top and the bottom of the SmartNIC. This doubles the amount of air that can be channeled through the product, ensuring superior cooling. Time Syncing Within an Appliance We offer the ability to time synchronize multiple FPGA SmartNICs with nanosecond precision within the same appliance. State-of-the-Art Monitoring The monitoring system keeps tabs on air temperature, voltage and power consumption. It includes an early warning system to ensure your investment is always protected. Heat Exhausts The carefully designed exhausts on the front of the SmartNIC ensure that the warm air exits the SmartNIC without increasing the temperature within the appliance or server housing.
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The Link™ NT200A02 SmartNIC Model Superior thermal control

To generate and control the airflow, the Napatech design contains a blower that takes in air from the top and bottom of the card, thereby doubling the amount of air and ensuring superior cooling.

Benefits

  • Durable design for extended real-life operation
  • Free choice of server platform
  • Reduced noise and power-consumption as server-fans can run at minimum speed
  • Freedom to pack unlimited FPGA SmartNICs into a standard server

Specs

  • No airflow dependency to server
  • Well-defined cooling of all critical components
  • Guaranteed device hot spot temperatures
  • Maximized airflow, ensuring optimal thermal performance
  • Dissipated energy exhaled outside server through front plate cutouts
  • Significant reduction in temperature drop between FPGA die and heat sink surface
  • Mechanical stiffener enabling higher screw torque for fastening heatsink to the PCB

Compliance

Napatech upholds the highest quality, environmental and safety standards, and complies with all applicable regulations across regions. This helps our customers to realize a seamless integration without delays – and ensures error-free operation throughout the product life cycle.

Ethernet Front Port Compliance

All Napatech designs maximize mechanical and electrical front port margin, securing trouble-free operation with the optical or electrical modules of the customer’s choice.

The thermal design is validated dissipating the maximum power level as standardized for the given form factor. Margin on the data interface has been optimized tuning the equalization parameters of the transceivers hosting the front port channel, maximizing EYE margin to the relevant standard.

EMC Compliance

All Napatech designs have passed EMC compliance testing for major regions, including Europe and North America. By ensuring compliance as an integral part of the design, the risk of delays is eliminated. Moreover, the EMC testing has been performed in a mainstream server, potentially directly applicable to the use case.

Environmental Compliance

The end product must adhere to regional environmental legislation. To enable trouble-free server integration, Napatech hardware is manufactured using only materials that fully comply with the current RoHS, REACH and proprietary Tier 1 legislation.

Full compliance from early inception eliminates the risk delays and product withdrawal due to authority intervention.

Event Handling & System Monitoring

To become an integral part of the server environment and maximize uptime, the hardware needs to monitor and expose key performance metrics to the application during operation. Napatech hardware monitors the following metrics:

  • Blower speed
  • Hot spot temperatures
  • Key supply voltages and currents
  • PCI protocol events
  • General system events

PCI Compliance

With the PCI interface dictated by the server plane, the hardware maximizes mechanical and electrical PCI margin, ensuring trouble-free operation in the server and server slot(s) of the customer’s choice. All designs have passed relevant PCI-SIG tests and have been adopted on the PCI-SIG integrators list.

Safety Compliance

To enable trouble-free server integration, Napatech hardware is fully compliant with all applicable safety standards.

By ensuring safety compliance as an integral part of the SmartNIC design, the risk of delays is eliminated. Compliance testing is performed in a mainstream server, potentially directly applicable to the use case.

Conflict Minerals Compliance

To ensure quick and trouble-free server integration, Napatech hardware is manufactured using only materials that fully comply with the relevant Conflict Mineral Legislation. For US based integrators, this facilitates submission of the mandatory Conflict Mineral report to SEC.

Shock & Vibration Robustness

Many server environments expose the card to substantial shock and vibration, predominantly during the transportation phase. To ensure trouble-free server integration and operational robustness throughout the product life cycle, validated design aspects include:

  • Cooling enclosure for superior mechanical stiffness
  • Key exposed components are under-filled (glued) to the PCB
  • Shock robustness validated against JESD22-B110A
  • Vibration robustness validated against ASTM D4169-09

Diagram

Flagship tech specs

TECH SPECS Link™ NT200A02 SmartNIC
Form factor Half length, full height PCIe
Front ports 2 x QSFP28 front ports supporting 1, 10, 25, 40, 50, 100 GbE
FPGA Xilinx Ultrascale+, XCVU5P-2FLGA2104E
On demand:
• XCVU7P-2FLVA2104E
• XCVU9P-2FLVA2104E
Optional: Speed Grade 1 or 3
Configuration flash 2 banks of 1 Gbit, 4 bit wide (QSPI)
Memory 3 x DDR4 banks of 64 bit @ 2666 Mbps, total: 12 GB
Optional: 24 GB using 16 Gbit devices
PCIe x16 Gen3
Optional: 2 x 8 Gen4 below PCIe spec v0.7 (1)
1000Base-T port RJ45 front port connected to 1 Gb PHY with full SyncE and IEEE 1588v2 capabilities
Single ended coaxial I/O Front port SMA connector and 2 internal MCX connectors
High-speed interconnect port Interconnect bidirectional bandwidth of 675 Gb/s with Napatech interconnect cable
Top: 2 x high-speed interconnect ports with 6 lanes each
Optional: Back: 3 x high-speed interconnect ports; 2 with 6 lanes each and 1 with 4 lanes + SPI, 12V and clock
Power consumption HW design: 120 W
UL compliant with NIM to 75 W
Idle: 5 W
Reference clock 20 MHz TCXO +/- 4.6 ppm
Optional: 20 MHz OCXO +/- 0.01 ppm
Board microcontroller ATxmega128A1U
Hardware board monitoring Temperature and power sensors

(1) For detailed information regarding limitation on PCIe Gen4 support in Xilinx UltraScale+, please contact Xilinx.

Applications ideal for FPGA processing

Based on Xilinx UltraScale+ FPGAs, Link™ Programmable is ideally suited for anything compute intensive and can be deployed across a variety of industries and applications.

High Efficiency Video Coding

Cryptomining

Machine Learning

High Frequency Trading

Analytics

Audio/Video DSP, Speech recognition, HiRes video, computer vision
Broadcast RealTime video, Encoders, EdgeQAM, Switching/Routing
Data Center Switching/Routing/Load balancing, Virtualization, Highspeed
High Performance Computing Data mining, AI Inference, Big Data analysis
Integrated Circuit Design ASIC prototyping, HW emulation
Financial Crypto Mining, High Frequency Trading
Medical CT Scan, MRI, X-Ray, PET, Ultrasound
Security Image processing, industrial imaging, Crypto, Authentication

Resources and downloads

Contact Sales

Find out if Link™ Programmable is right for you.

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