NT50B01 SmartNIC with
Low-Profile PCIe SmartNIC
The NT50B01 SmartNIC enables 2×10/25G applications, depending on your choice of software. This provides flexibility to create high-performance solutions in 1U server platforms for 10/25G network infrastructures.
NT50B01 is a low-profile PCIe card specifically engineered to reduce footprint without compromising on performance. The card not only saves rack space and reduces TCO – it also provides outstanding agility and scalability for the future. The design delivers best-of-breed reliability and includes a proprietary full body heatsink developed to ensure optimal thermal performance for all critical components.
Based on a Xilinx Kintex UltraScale+ FPGA, NT50B01 can be reconfigured to support specific SmartNIC functionality. By exploiting the FPGA programmability, features and capacity can be extended to continually accommodate data growth and changing industry standards.
Full Open vSwitch (OVS) Offload
NT50B01 comes with fully qualified software, compliant with popular operating systems to enable easy qualification and quick deployment.
Combined with Napatech Link™ Virtualization Software, the NT50B01 SmartNIC provides a hardware-based solution for full Open vSwitch (OVS) offload – dramatically increasing performance while reducing CPU utilization.
Link-Virtualization Software supports a broad range of applications and use cases and can quickly improve an organization’s ability to monetize virtualized applications.
• OpenStack support
• Full OVS/DPDK offload
• VirtIO w/vDPA
• DPDK+vDPA support
• Live Migration
Compatible Virtualization Software
Link-Virtualization Software offloads and accelerates the
Open vSwitch (OVS) dataplane to provide increased network performance
and better CPU efficiency with lower complexity.
For any link speed at any time
For 10/25G port speeds
PLUG & PLAY
Out of the box solution
Multiple FPGA SmartNICs in one server
Synchronize multiple servers
Accelerate your application
Support for Virtualized Environments
Multiple speeds in one server
More powerful server usage
What our engineers say:
Designed for epic performance.
Lower power, space, and cooling.
To generate and control the airflow, the Napatech design contains a blower that takes in air from the top and bottom of the SmartNIC, thereby doubling the amount of air and ensuring superior cooling.
- Durable design for extended real-life operation
- Free choice of server platform
- Reduced noise and power-consumption as server-fans can run at minimum speed
- Freedom to pack unlimited FPGA SmartNICs into a standard server
- No airflow dependency to server
- Well-defined cooling of all critical components
- Guaranteed device hot spot temperatures
- Maximized airflow, ensuring optimal thermal performance
- Dissipated energy exhaled outside server through front plate cutouts
- Significant reduction in temperature drop between FPGA die and heat sink surface
- Mechanical stiffener enabling higher screw torque for fastening heatsink to the PCB
Napatech upholds the highest quality, environmental and safety standards, and complies with all applicable regulations across regions. This helps our customers to realize a seamless integration without delays – and ensures error-free operation throughout the product life cycle.
Ethernet Front Port Compliance
The SmartNIC design maximizes mechanical and electrical front port margin, securing trouble-free operation with the optical or electrical modules of the customer’s choice.
The thermal design is validated dissipating the maximum power level as standardized for the given form factor. Margin on the data interface has been optimized tuning the equalization parameters of the transceivers hosting the front port channel, maximizing EYE margin to the relevant standard.
All Napatech designs have passed EMC compliance testing for major regions, including Europe and North America. By ensuring compliance as an integral part of the design, the risk of delays is eliminated. Moreover, the EMC testing has been performed in a mainstream server, potentially directly applicable to the use case.
The end product (server + installed SmartNIC) must adhere to regional environmental legislation. To enable trouble-free server integration, Napatech SmartNICs are manufactured using only materials that fully comply with the current RoHS, REACH and proprietary Tier 1 legislation.
Full compliance from early inception eliminates the risk delays and product withdrawal due to authority intervention.
Event Handling & System Monitoring
In order for the SmartNIC to become an integral part of the server environment and maximize uptime, it needs to monitor and expose key performance metrics to the application during operation. Napatech SmartNICs monitor the following metrics:
- Blower speed
- Hot spot temperatures
- Key supply voltages and currents
- PCI protocol events
- General system events
With the PCI interface on the SmartNIC dictated by the server plane, the hardware maximizes mechanical and electrical PCI margin, ensuring trouble-free operation in the server and server slot(s) of the customer’s choice. All designs have passed relevant PCI-SIG tests and have been adopted on the PCI-SIG integrators list.
To enable trouble-free server integration, Napatech SmartNICs are fully compliant with all applicable safety standards.
By ensuring safety compliance as an integral part of the SmartNIC design, the risk of delays is eliminated. Compliance testing is performed in a mainstream server, potentially directly applicable to the use case.
Conflict Minerals Compliance
To ensure quick and trouble-free server integration, Napatech SmartNICs are manufactured using only materials that fully comply with the relevant Conflict Mineral Legislation. For US based SmartNIC integrators, this facilitates submission of the mandatory Conflict Mineral report to SEC.
Shock & Vibration Robustness
Many server environments expose the SmartNIC to substantial shock and vibration, predominantly during the transportation phase. To ensure trouble-free server integration and operational robustness throughout the product life cycle, validated design aspects include:
- Cooling enclosure for superior mechanical stiffness
- Key exposed components are under-filled (glued) to the PCB
- Shock robustness validated against JESD22-B110A
- Vibration robustness validated against ASTM D4169-09
Used across industries
Telecom operators and Cloud-based data centers
With the increasing number of telecom carriers and CSPs migrating to 25G solutions, the need to continually upgrade network performance is growing.
Cloud-based data center network architectures, 5G/edge computing and the Internet of Things (IOT) are driving an incredible scale in bandwidth, number of users, and network flows. These factors are driving the explosive growth in the 25GbE server-class Ethernet adapter market with programmable SmartNICs offering the highest CAGR in all segments in the Ethernet NIC market
The Napatech NT50B01 SmartNICs deliver complete platforms to address numerous demanding networking and security workloads including hardware offloladed virtual switching to accelerate NFV, and 4G/5G mobile applications This flexible solution save rack space and reduce the overall solution cost by offloading virtual switching workloads returning valuable CPU cycles to the general purpose CPU for application processing.
Ultimate tech specs
|Open vSwitch (OVS) features||• Full OVS-DPDK hardware offload (OVS 2.12/DPDK 18.11)
• 130 Mpps switching performance @ 64B
• 100 Gbps switching capacity
• OpenStack support
• Fully accelerated VirtIO 1.1 with vDPA
• Transparent VirtIO 0.95/1.0 support
• OVS statistics
• VM-to-VM mirroring for analytics, SLA monitoring, regulatory
• Non-degrading HW Megaflow cache for tracking billions of flows
• Extensive and configurable match processing for L2-4 packet headers
• VLAN/VXLAN encapsulation/decapsulation
• RSS load balancing
• Link aggregation (active/active and active/passive)
• Jumbo frame support
• Quality of Service (QoS)
• Hardware QoS
• RHEL 8/CentOS 8 and Ubuntu Server LTS support
|Supported pluggable modules||• 10G: SFP+; 10GBASE-SR, LR, CR
• 25G: SFP28; 25GBASE-SR, LR, LR-BiDi
• 10/25G: SFP28; dual rate 10/25GBASE-SR, LR
|Dimensions||• ½-length, ½-height PCIe|
|FPGA technology||• XCKU15P|
|SDRAM||• 10 GB DDR4|
|PCIe Configuration||• PCIe Gen3 16 lanes @ 8 GT/s|
|Network Ports||• 2xSFP28|
|Time Synchronization Support||• Stratum 3E compliant TCXO|
|High-Speed Interconnect Port||• Maximum bidirectional bandwidth 900Gbps|
|Hardware Board Monitoring||• FPGA temperature
• Pluggable module temperature
• Ambient temperature
• Power sensors
|Power and Cooling||• Cooling solution: Passive
• Max. power dissipation: 55W
• Idle power dissipation: 10W
• Airflow requirement: >= 3.5 m/s
|General Hardware Properties||• Operating temperature: -5 °C to 55 °C (23 °F to 131 °F)
• Operating humidity: 5% to 85%
• Altitude: < 1,800 m
|Regulatory compliance (common)||• PCI-SIG®, NEBS level 3, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM|
|Regulatory compliance (product specific)||• KCC|
|Regulatory Approvals and Compliances||• PCI-SIG®
• NEBS level 3
• cURus (UL)