SmartNIC and DPU Hardware Portfolio
Product Overview
SmartNIC and DPU Hardware
In a world of reconfigurable computing, it is the software that defines the use case functionality. However, the wrong choice of hardware can severely downgrade the overall value and reliability of the solution.
Napatech SmartNICs and Data Processing Unit (DPU) are designed to meet the standards of modern servers, with the rapidly changing world of data center and hyperscale deployments in mind.
Industry-Leading Reliability
When selecting a hardware solution, reliability is of the utmost importance. Software can be patched if faulty, but hardware needs a physical replacement, which is costly and complex.
For all Napatech designs, performance and reliability are unconditional tenets. With ~300,000 hours of mean time between failures (MTBF), Napatech hardware ensures uninterrupted, error-free operation for many years ahead – as validated by our long-term loyal customer base.
Superior Thermal Design
The power of SmartNIC and DPU technologies is only of value if it can be harnessed – and that requires cooling. An efficient cooling solution allows you to fit more compute power into your rack space, which translates into substantial TCO benefits. Napatech SmartNICs and DPUs are designed with active and passive cooling. The active solution provides 100% self-contained cooling with no requirements for a specific server airflow. This solution exhales most of the dissipated energy outside the server through front plate cutouts, which gives customers the freedom to choose server designs without worrying about cooling capacity.
To meet telco requirements, Napatech provides passively cooled solutions which are NEBS-compliant. A proprietary full body heatsink has been developed securing optimal cooling performance in the challenging NEBS applications for all critical components in the SmartNIC or DPU.
Hardware Resilience
Modern servers have quick-release PCI fastening mechanisms that allow for easy card replacement. Some of these designs, however, expose the card to vibration during transportation. Napatech SmartNICs and DPUs are designed specifically to ensure hardware resilience in this environment.
Standards of Excellence
Network appliances often require exceptions and compromises to fit a certain form factor or price point. In complex data center environments, it is therefore extremely beneficial if the hardware adheres to established industry standards, as this will make it easier for customers to integrate it in their solution. As a certified PCI-SIG member, Napatech has completed the meticulous compliance test, which demonstrates high standards of excellence.
Typical Applications
Napatech offers a range of software options for the SmartNIC and DPU hardware, addressing use cases within:
- Cybersecurity
- Network quality of experience assurance
- Network & security forensics
- Application performance management
- Network test & measurement
- Cyber defense
- vSwitch acceleration
- Virtual network monitoring
- Storage offload
- Network security offload
Solutions
Application and network performance monitoring
Subscriber monitoring
Capture to disk, replay from disk
Latency measurements
Cybersecurity threat detection
Network test and measurement
Cybersecurity threat prevention
5G User Plane Function (UPF) offlload
Full host CPU offload
OpenStack Infrastructure-as-a-Service (IaaS)
Bare metal cloud platform IaaS with tenant isolation
Platforms
Link-Capture™ Software
Link-Inline™ Software
Link-Virtualization™ Software
Link-Storage™ Software
Link-Security™ Software
Link-Programmable™
Smart Network Interface Cards (SmartNICs)
Data Processing Units (DPUs)
Services
Professional Services
Custom Development
| DPU Hardware Passive Cooling Models |
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| Model |
F2070X |
F3076X |
| FPGA | AGFC023 | AGIC041 |
| – Embedded SoC | ||
| – Crypto | AES and SM4 | AES and SM4 |
| System on Chip (SoC) | Intel® Xeon® D-1736, 8 cores 2.3 – 3.4 GHz 15MB cache | Intel® Xeon® 6532P-B, 32 cores 2.20 GHz 128MB cache |
| Memory | ||
| SDRAM FPGA | 4x4GB 40b DDR4 ECC support 18GB total | 4x4GB 40b DDR4 ECC support 18GB total |
| SDRAM SoC | 2x8GB 72b DDR4 ECC support 18GB total | 4x12GB 72b DDR5 ECC support 54GB total |
| QSPI Flash memory for FPGA images | 2×2048 Mbit | 2×2048 Mbit |
| M.2 NVMe x4 expansion slot for SSD | Up to 2 TB (2230/2242) | Up to 2 TB (2230) |
| PCI Express | ||
| PCIe host interface | PCIe4 x16 | PCIe5 x16 |
| PCIe expansion ports | PCIe5 x16 | |
| Network Ports and Link Speeds | ||
| Network ports | 2 × QSFP56 | 2 × QSFP-DD |
| 1G [2] | √ [3] | |
| 10G [2] | √ [3] | √ [3] |
| 25G [2] | √ [3] | √ [3] |
| 40G [2] | √ | √ |
| 50G [2] | √ [4] | √ [4] |
| 100G [2] | √ | √ |
| 200G [2] | √ | |
| 400G [2] | √ | |
| Time Synchronization [2] | ||
| Stratum 3 compliant TCXO | ||
| Internal MCX-F for PPS and NT-TS | ||
| RJ45-F 1000BASE-T IEEE1588 PTP (on PCI bracket) | ||
| Board Management | ||
| RJ45 1000BaseT SoC management port | √ | √ |
| USB-A SoC management port | √ | |
| USB-C SoC management port | √ | |
|
MCTP over SMBus |
√ | √ |
| PLDM for Monitor and Control | √ | √ |
| NCSI RBT | √ | √ |
| Temperature and power sensors | √ | √ |
| Form Factor, Power, and Cooling | ||
| Height | Full | Full |
| Length | Half | 3/4 |
| Width | Dual-Slot | Dual-Slot |
| Weight | 682 g | 953 g |
| Max. power dissipation supported by platform [5] | 250 W | 375 W |
| Airflow requirement at max power dissipation | >= 2.5 m/s | >= 4.0 m/s |
| Operating Environment | ||
| Temperature | -5 °C to 45 °C (23 °F to 113 °F) | |
| Humidity | 5% to 85% | |
| Regulatory Approvals and Compliances | ||
| MTBF (hours) | 286.313 | 238.135 |
| Regulatory compliance (common) | PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM | |
| Regulatory compliance (product-specific) | KCC | KCC |
[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload.
Refer to the Napatech product/feature data sheets for actual power consumption.
[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech
| SmartNIC Hardware Active Cooling Models |
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| Model | NT40A11-SCC | NT100A01-SCC | NT200A02-SCC | NT400D11-SCC | NT400D13-SCC | N3072XBA34S |
| FPGA | XCKU11P | XCVU5P | XCVU5P | AGFA014 | AGFB022 | AGIB027 |
| – Embedded SoC | Quad-core Arm Cortex-A53 | |||||
| – Crypto | ||||||
| Memory | ||||||
| SDRAM FPGA | 1x4GB 64b DDR4 4GB total |
2x4GB 64b DDR4 8GB total | 3x4GB 64b DDR4 12GB total | 3x4GB 64b DDR4 12GB total | 4x4GB 72b DDR4 ECC support 18GB total | 3/4x4GB 72b DDR4 ECC support 18GB total |
| SDRAM SoC | 1x4GB 72b DDR4 allocated from FPGA memory pool | |||||
| QSPI Flash memory | 2×512 Mbit | 2×512 Mbit | 2×512 Mbit | 2×1024 Mbit | 2×1024 Mbit | 2×2048 Mbit |
| PCI Express | ||||||
| PCIe host interface | PCIe3 x 8 | PCIe3 x16 | PCIe3 x16 | PCIe4 x16 | PCIe4 x16 | PCIe5 x16, CXL 2.0 |
| PCIe expansion ports | ||||||
| PCIe mezzanine interface | ||||||
| High-Speed Interconnect Port [2] | ||||||
| Maximum bidirectional bandwidth | 822 Gbps | 900 Gbps | 900 Gbps | 900 Gbps | 900 Gbps | |
| Network Ports and Link Speeds | ||||||
| Network ports | 4 × SFP+ | 4 × SFP28 | 2 × QSFP28 | 2 × QSFP56 | 2 × QSFP56 | 2 x QSFP-DD |
| 1G [2] | √ | √ | √ [3] | √ [3] | √ [3] | √ [3] |
| 10G [2] | √ | √ | √ [3] | √ [3] | √ [3] | √ [3] |
| 25G [2] | √ | √ [3] | √ [3] | √ [3] | √ [3] | |
| 40G [2] | √ | √ | √ | √ | ||
| 50G [2] | √ [4] | √ [4] | ||||
| 100G [2] | √ | √ | √ | √ | ||
| 200G [2] | √ | √ | ||||
| 400G [2] | √ | |||||
| Time Synchronization [2] | ||||||
| Stratum 3 compliant TCXO | √ [1][6] | √ [6] | √ [6] | √ [6] | √ | √ |
| RJ45-F 1000BASE-T IEEE1588 PTP (on PCI bracket) |
1 | 1 | 1 [1] | 1 [1] | 1 [1] | |
| SMA-F for PPS & 10Mhz (on PCI bracket) |
1 | 1 | 1 [1] | 2 [1] | 2 [1] | |
| Tyco Mini female for RJ45-F/ SMA-F adapter (on PCI bracket) |
||||||
| Internal MCX-F for PPS and NT-TS | 2 | 2 | 2 [1] | 2 [1] | ||
| Synchronous Ethernet (SyncE) over RJ45 port [2] | √ | |||||
|
Board Management |
||||||
| RJ45 1000BaseT SoC management port | ||||||
| USB-C SoC management port | ||||||
| MCTP over SMBus | √ | √ | √ | √ | √ | |
| PLDM for Monitor and Control | √ | √ | √ | √ | √ | |
| NCSI RBT | √ | √ | √ | |||
| Temperature, fan, and power sensors | √ | √ | √ | √ | √ | √ |
| Form Factor, Power, and Cooling | ||||||
| Height | Full | Full | Full | Full | Full | Full |
| Length | Half | Half | Half | Half | 3/4 | 3/4 |
| Width | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot |
| Weight | 355 g | 355 g | 355 g | 340 g | TBD | TBD |
| Max. power dissipation [5] | 58 W | 75 W | 120 W | 120 W | 120 W | 150 W |
| Airflow requirement | None | None | None | None | None | None |
| Operating Environment | ||||||
| Temperature | 0 °C to 45 °C (32 °F to 113 °F) | |||||
| Humidity | 20% to 80% | |||||
| Regulatory Approvals and Compliances | ||||||
| MTBF (hours) | 317,821 | 317,821 | 317,821 | 497,216 | 497,216 | TBD |
| Regulatory compliance (common) | PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM | |||||
| Regulatory compliance (product-specific) | KCC[7] | KCC | KCC | KCC[7] | KCC[7] | KCC[7] |
[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload.
Refer to the Napatech product/feature data sheets for actual power consumption.
[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech
| SmartNIC Hardware Passive Cooling Models |
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| Model | NT50B01 | NT40A11-NEBS | NT100A01-NEBS | NT200A02-NEBS | NT400D11-NEBS | NT400D13- PC | N3070XP34 | N3072XBP12S | N3072XBP34S | N3076XDP34S |
| FPGA | XCKU15P | XCKU11P | XCVU5P | XCVU5P | AGFA014 | AGFB022 | AGIC041 | AGIB027 | AGIB027 | AGID041 |
| – Embedded SoC | Quad-core Arm Cortex-A53 [1] | Quad-core Arm Cortex-A53 [1] | Quad-core Arm Cortex-A53 [1] | |||||||
| – Crypto | AES and SM4 [1] | AES and SM4 [1] | ||||||||
| Memory | ||||||||||
| SDRAM FPGA | 2x4GB 64b DDR4 ECC support 10GB total | 1x4GB 64b DDR4 4GB total | 2x4GB 64b DDR4 8GB total | 3x4GB 64b DDR4 12GB total | 3x4GB 64b DDR4 12GB total | 4x4GB 72b DDR4 ECC support 18GB total | 4x4GB 40b DDR4 ECC support 18GB total | 4x4GB 72b DDR4 ECC support 18GB total | 4x4GB 72b DDR4 ECC support 18GB total | 4x8GB 72b DDR4 1x4GB 40b DDR4 ECC support 41GB total |
| SDRAM SoC | 1x4GB 72b DDR4 allocated from FPGA memory pool | 1x4GB 72b DDR4 allocated from FPGA memory pool | 1x4GB 40b DDR4 allocated from FPGA memory pool | |||||||
| QSPI Flash memory | 2×512 Mbit | 2×512 Mbit | 2×512 Mbit | 2×512 Mbit | 2×1024 Mbit | 2×1024 Mbit | 2×2048 Mbit | 2×2048 Mbit | 2×2048 Mbit | 2×2048 Mbit |
| PCI Express | ||||||||||
| PCIe host interface | PCIe3 x16 | PCIe3 x 8 | PCIe3 x16 | PCIe3 x16 | PCIe4 x16 | PCIe4 x16 | PCIe5 x16 | PCIe5 x16, CXL 2.0 |
PCIe5 x16, CXL 2.0 |
PCIe5 x16, CXL 2.0 |
| PCIe expansion ports | PCIe5 x16, CXL 2.0 |
PCIe5 x16, CXL 2.0 |
||||||||
| PCIe mezzanine interface | PCIe5 x16 | |||||||||
| High-Speed Interconnect Port [2] | ||||||||||
| Maximum bidirectional bandwidth | 900 Gbps | 822 Gbps | 900 Gbps | 900 Gbps | 900 Gbps | 900 Gbps | ||||
| Network Ports and Link Speeds | ||||||||||
| Network ports | 2xSFP28 | 4×SFP+ | 4×SFP28 | 2xQSFP28 | 2xQSFP56 | 2xQSFP56 | 2xQSFP-DD | 2×QSFP-DD | 2xQSFP-DD | 2xQSFP-DD |
| 1G [2] | √ | √ | √ | √ [3] | √ [3] | √ [3] | ||||
| 10G [2] | √ | √ | √ | √ [3] | √ [3] | √ [3] | √ [3] | √ [3] | √ [3] | √ [3] |
| 25G [2] | √ | √ | √ [3] | √ [3] | √ [3] | √ [3] | √ [3] | √ [3] | √ [3] | |
| 40G [2] | √ | √ | √ | √ | √ | √ | √ | |||
| 50G [2] | √ [4] | √ [4] | √ [4] | √ [4] | √ [4] | |||||
| 100G [2] | √ | √ | √ | √ | √ | √ | √ | |||
| 200G [2] | √ | √ | √ | √ | √ | |||||
| 400G [2] | √ | √ | √ | √ | ||||||
| Time Synchronization [2] | ||||||||||
| Stratum 3 compliant TCXO | √ [1][6] | √ [1][6] | √ [6] | √ [6] | √ [6] | √ [6] | √ [6] | 1 [1] | 1 [1] | 1 [1] |
| RJ45-F 1000BASE-T IEEE1588 PTP (on PCI bracket) |
1 | 1 | 1 [1] | 1 [1] | 1 [1] | 1 [1] | ||||
| SMA-F for PPS & 10Mhz (on PCI bracket) |
1 [1] | 1 | 1 | 1 [1] | 2 [1] | 1 [1] | 1 [1] | 1 [1] | ||
| Tyco Mini female for RJ45-F/ SMA-F adapter (on PCI bracket) |
||||||||||
| Internal MCX-F for PPS and NT-TS | 2 | 2 | 2 [1] | 1 [1] | 1 [1] | 1 [1] | ||||
| Synchronous Ethernet (SyncE) over RJ45 port [2] |
√ | |||||||||
| Board Management | ||||||||||
| RJ45 1000BaseT SoC management port | √ | √ | √ | |||||||
| USB-C SoC management port | √ | √ | √ | |||||||
| MCTP over SMBus | √ | √ | √ | √ | √ | √ | √ | √ | ||
| PLDM for Monitor and Control | √ | √ | √ | √ | √ | √ | √ | √ | ||
| NCSI RBT | √ | √ | √ | √ | √ | √ | ||||
| Temperature and power sensors | √ | √ | √ | √ | √ | √ | √ | √ | √ | √ |
| Form Factor, Power, and Cooling | ||||||||||
| Height | Half | Full | Full | Full | Full | Full | Full | Full | Full | Full |
| Length | Half | Half | Half | Half | Half | Half | 3/4 | Half | 3/4 | 3/4 |
| Width | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot | Single-Slot |
| Weight | 204 g | 317 g | 350 g | 350 g | 340 g | 340 g | TBD | TBD | TBD | TBD |
| Max. power dissipation supported by platform [5] |
55 W | 58 W | 75 W | 120 W | 120 W | 120 W | 150 W | 150 W | 150 W | 150 W |
| Airflow (forward) requirement at max power dissipation |
>= 3.5 m/sw | >= 2.5 m/s | >= 2.5 m/s | >= 2.5 m/s | >= 3.5 m/s | >= 3.5 m/s | >= 4.0 m/s | >= 6.5 m/s | >= 5.6 m/s | >= 5.6 m/s |
| Operating Environment | ||||||||||
| Temperature | –5 °C to 55 °C (23 °F to 131 °F) | -5 °C to 45 °C (23 °F to 113 °F) | ||||||||
| Humidity | 5% to 85% | |||||||||
| Regulatory Approvals and Compliances | ||||||||||
| MTBF (hours) | 991,182 | 398,565 | 398,565 | 398,565 | 593,730 | 593,730 | 519.049 | TBD | TBD | TBD |
| Regulatory compliance (common) |
PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM | |||||||||
| Regulatory compliance (product specific) |
NEBS, KCC [7] | NEBS, KCC [7] | NEBS, KCC [7] | NEBS, KCC [7] | NEBS, KCC [7] | KCC [7] | KCC | KCC | KCC | KCC |
[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload.
Refer to the Napatech product/feature data sheets for actual power consumption.
[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech
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