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SmartNIC and DPU Hardware Portfolio

Product Overview

SmartNIC and DPU Hardware

In a world of reconfigurable computing, it is the software that defines the use case functionality. However, the wrong choice of hardware can severely downgrade the overall value and reliability of the solution.

Napatech SmartNICs and Data Processing Unit (DPU) are designed to meet the standards of modern servers, with the rapidly changing world of data center and hyperscale deployments in mind.

Industry-Leading Reliability
When selecting a hardware solution, reliability is of the utmost importance. Software can be patched if faulty, but hardware needs a physical replacement, which is costly and complex.

For all Napatech designs, performance and reliability are unconditional tenets. With ~300,000 hours of mean time between failures (MTBF), Napatech hardware ensures uninterrupted, error-free operation for many years ahead – as validated by our long-term loyal customer base.

Superior Thermal Design
The power of SmartNIC and DPU technologies is only of value if it can be harnessed – and that requires cooling. An efficient cooling solution allows you to fit more compute power into your rack space, which translates into substantial TCO benefits. Napatech SmartNICs and DPUs are designed with active and passive cooling. The active solution provides 100% self-contained cooling with no requirements for a specific server airflow. This solution exhales most of the dissipated energy outside the server through front plate cutouts, which gives customers the freedom to choose server designs without worrying about cooling capacity.

To meet telco requirements, Napatech provides passively cooled solutions which are NEBS-compliant. A proprietary full body heatsink has been developed securing optimal cooling performance in the challenging NEBS applications for all critical components in the SmartNIC or DPU.

Hardware Resilience
Modern servers have quick-release PCI fastening mechanisms that allow for easy card replacement. Some of these designs, however, expose the card to vibration during transportation. Napatech SmartNICs and DPUs are designed specifically to ensure hardware resilience in this environment.

Standards of Excellence
Network appliances often require exceptions and compromises to fit a certain form factor or price point. In complex data center environments, it is therefore extremely beneficial if the hardware adheres to established industry standards, as this will make it easier for customers to integrate it in their solution. As a certified PCI-SIG member, Napatech has completed the meticulous compliance test, which demonstrates high standards of excellence.

Typical Applications
Napatech offers a range of software options for the SmartNIC and DPU hardware, addressing use cases within:

  • Cybersecurity
  • Network quality of experience assurance
  • Network & security forensics
  • Application performance management
  • Network test & measurement
  • Cyber defense
  • vSwitch acceleration
  • Virtual network monitoring
  • Storage offload
  • Network security offload

Solutions
Application and network performance monitoring
Subscriber monitoring
Capture to disk, replay from disk
Latency measurements
Cybersecurity threat detection
Network test and measurement
Cybersecurity threat prevention
5G User Plane Function (UPF) offlload
Full host CPU offload
OpenStack Infrastructure-as-a-Service (IaaS)
Bare metal cloud platform IaaS with tenant isolation

Platforms
Link-Capture™ Software
Link-Inline™ Software
Link-Virtualization™ Software
Link-Storage™ Software
Link-Security™ Software
Link-Programmable™
Smart Network Interface Cards (SmartNICs)
Data Processing Units (DPUs)

Services
Professional Services
Custom Development

 

DPU Hardware
Passive Cooling Models
Model

F2070X

F3076X
FPGA AGFC023 AGIC041
– Embedded SoC    
– Crypto AES and SM4 AES and SM4
System on Chip (SoC) Intel® Xeon® D-1736, 8 cores 2.3 – 3.4 GHz 15MB cache Intel® Xeon® 6532P-B, 32 cores 2.20 GHz 128MB cache
Memory    
SDRAM FPGA 4x4GB 40b DDR4 ECC support 18GB total 4x4GB 40b DDR4 ECC support 18GB total
SDRAM SoC 2x8GB 72b DDR4 ECC support 18GB total 4x12GB 72b DDR5 ECC support 54GB total
QSPI Flash memory for FPGA images 2×2048 Mbit 2×2048 Mbit
M.2 NVMe x4 expansion slot for SSD Up to 2 TB (2230/2242) Up to 2 TB (2230)
PCI Express    
PCIe host interface PCIe4 x16 PCIe5 x16
PCIe expansion ports   PCIe5 x16
Network Ports and Link Speeds    
Network ports 2 × QSFP56 2 × QSFP-DD
1G [2] [3]  
10G [2] [3] [3]
25G [2] [3] [3]
40G [2]
50G [2] [4] [4]
100G [2]
200G [2]  
400G [2]  
Time Synchronization [2]    
Stratum 3 compliant TCXO    
Internal MCX-F for PPS and NT-TS    
RJ45-F 1000BASE-T IEEE1588 PTP (on PCI bracket)    
Board Management    
RJ45 1000BaseT SoC management port
USB-A SoC management port  
USB-C SoC management port  

MCTP over SMBus

PLDM for Monitor and Control
NCSI RBT
Temperature and power sensors
Form Factor, Power, and Cooling    
Height Full Full
Length Half 3/4
Width Dual-Slot Dual-Slot
Weight 682 g 953 g
Max. power dissipation supported by platform [5] 250 W 375 W
Airflow requirement at max power dissipation >= 2.5 m/s >= 4.0 m/s
Operating Environment    
Temperature -5 °C to 45 °C (23 °F to 113 °F)
Humidity 5% to 85%
Regulatory Approvals and Compliances    
MTBF (hours) 286.313 238.135
Regulatory compliance (common) PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance (product-specific) KCC KCC

[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload.
Refer to the Napatech product/feature data sheets for actual power consumption.

[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech

 

SmartNIC Hardware
Active Cooling Models
Model NT40A11-SCC NT100A01-SCC NT200A02-SCC NT400D11-SCC NT400D13-SCC N3072XBA34S
FPGA XCKU11P XCVU5P XCVU5P AGFA014 AGFB022 AGIB027
– Embedded SoC           Quad-core Arm Cortex-A53
– Crypto            
Memory            
SDRAM FPGA 1x4GB 64b DDR4
4GB total
2x4GB 64b DDR4 8GB total 3x4GB 64b DDR4 12GB total 3x4GB 64b DDR4 12GB total 4x4GB 72b DDR4 ECC support 18GB total 3/4x4GB 72b DDR4 ECC support 18GB total
SDRAM SoC           1x4GB 72b DDR4 allocated from FPGA memory pool
QSPI Flash memory 2×512 Mbit 2×512 Mbit 2×512 Mbit 2×1024 Mbit 2×1024 Mbit 2×2048 Mbit
PCI Express            
PCIe host interface PCIe3 x 8 PCIe3 x16 PCIe3 x16 PCIe4 x16 PCIe4 x16 PCIe5 x16, CXL 2.0
PCIe expansion ports            
PCIe mezzanine interface            
High-Speed Interconnect Port [2]            
Maximum bidirectional bandwidth 822 Gbps 900 Gbps 900 Gbps 900 Gbps 900 Gbps  
Network Ports and Link Speeds            
Network ports 4 × SFP+ 4 × SFP28 2 × QSFP28 2 × QSFP56 2 × QSFP56 2 x QSFP-DD
1G [2] [3] [3] [3] [3]
10G [2] [3] [3] [3] [3]
25G [2]   [3] [3] [3] [3]
40G [2]    
50G [2]         [4] [4]
100G [2]    
200G [2]        
400G [2]          
Time Synchronization [2]            
Stratum 3 compliant TCXO [1][6] √ [6] √ [6] √ [6]
RJ45-F 1000BASE-T IEEE1588 PTP
(on PCI bracket)
  1 1 1 [1] 1 [1] 1 [1]
SMA-F for PPS & 10Mhz
(on PCI bracket)
  1 1 1 [1] 2 [1] 2 [1]
Tyco Mini female for RJ45-F/ SMA-F adapter
(on PCI bracket)
           
Internal MCX-F for PPS and NT-TS   2 2   2 [1] 2 [1]
Synchronous Ethernet (SyncE) over RJ45 port [2]          

Board Management

           
RJ45 1000BaseT SoC management port            
USB-C SoC management port            
MCTP over SMBus  
PLDM for Monitor and Control  
NCSI RBT      
Temperature, fan, and power sensors
Form Factor, Power, and Cooling            
Height Full Full Full Full Full Full
Length Half Half Half Half 3/4 3/4
Width Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot
Weight 355 g 355 g 355 g 340 g TBD TBD
Max. power dissipation [5] 58 W 75 W 120 W 120 W 120 W 150 W
Airflow requirement None None None None None None
Operating Environment            
Temperature 0 °C to 45 °C (32 °F to 113 °F)
Humidity  20% to 80%
Regulatory Approvals and Compliances            
MTBF (hours) 317,821 317,821 317,821 497,216 497,216 TBD
Regulatory compliance (common) PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance (product-specific) KCC[7] KCC KCC KCC[7] KCC[7] KCC[7]

[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload.
Refer to the Napatech product/feature data sheets for actual power consumption.

[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech

SmartNIC Hardware
Passive Cooling Models
Model NT50B01 NT40A11-NEBS NT100A01-NEBS NT200A02-NEBS NT400D11-NEBS NT400D13- PC N3070XP34 N3072XBP12S N3072XBP34S N3076XDP34S
FPGA XCKU15P XCKU11P XCVU5P XCVU5P AGFA014 AGFB022 AGIC041 AGIB027 AGIB027 AGID041
– Embedded SoC               Quad-core Arm Cortex-A53 [1] Quad-core Arm Cortex-A53 [1] Quad-core Arm Cortex-A53 [1]
– Crypto             AES and SM4 [1]     AES and SM4 [1]
Memory                    
SDRAM FPGA 2x4GB 64b DDR4 ECC support 10GB total 1x4GB 64b DDR4 4GB total 2x4GB 64b DDR4 8GB total 3x4GB 64b DDR4 12GB total 3x4GB 64b DDR4 12GB total 4x4GB 72b DDR4 ECC support 18GB total 4x4GB 40b DDR4 ECC support 18GB total 4x4GB 72b DDR4 ECC support 18GB total 4x4GB 72b DDR4 ECC support 18GB total 4x8GB 72b DDR4 1x4GB 40b DDR4 ECC support 41GB total
SDRAM SoC               1x4GB 72b DDR4 allocated from FPGA memory pool 1x4GB 72b DDR4 allocated from FPGA memory pool 1x4GB 40b DDR4 allocated from FPGA memory pool
QSPI Flash memory 2×512 Mbit 2×512 Mbit 2×512 Mbit 2×512 Mbit 2×1024 Mbit 2×1024 Mbit 2×2048 Mbit 2×2048 Mbit 2×2048 Mbit 2×2048 Mbit
PCI Express                    
PCIe host interface PCIe3 x16 PCIe3 x 8 PCIe3 x16 PCIe3 x16 PCIe4 x16 PCIe4 x16 PCIe5 x16 PCIe5 x16,
CXL 2.0
PCIe5 x16,
CXL 2.0
PCIe5 x16,
CXL 2.0
PCIe expansion ports               PCIe5 x16,
CXL 2.0
  PCIe5 x16,
CXL 2.0
PCIe mezzanine interface               PCIe5 x16    
High-Speed Interconnect Port [2]                    
Maximum bidirectional bandwidth 900 Gbps 822 Gbps 900 Gbps 900 Gbps 900 Gbps 900 Gbps        
Network Ports and Link Speeds                    
Network ports 2xSFP28 4×SFP+ 4×SFP28 2xQSFP28 2xQSFP56 2xQSFP56 2xQSFP-DD 2×QSFP-DD 2xQSFP-DD 2xQSFP-DD
1G [2] [3] [3] [3]        
10G [2] [3] [3] [3] [3] [3] [3] [3]
25G [2]   [3] [3] [3] [3] [3] [3] [3]
40G [2]      
50G [2]           [4] [4] [4] [4] [4]
100G [2]      
200G [2]          
400G [2]            
Time Synchronization [2]                    
Stratum 3 compliant TCXO [1][6] [1][6] [6] [6] [6] [6] [6] 1 [1] 1 [1] 1 [1]
RJ45-F 1000BASE-T
IEEE1588 PTP
(on PCI bracket)
    1 1 1 [1] 1 [1]   1 [1] 1 [1]  
SMA-F for PPS & 10Mhz
(on PCI bracket)
1 [1]   1 1 1 [1] 2 [1]   1 [1] 1 [1] 1 [1]
Tyco Mini female for
RJ45-F/ SMA-F adapter
(on PCI bracket)
                   
Internal MCX-F for PPS and NT-TS     2 2   2 [1]   1 [1] 1 [1] 1 [1]
Synchronous Ethernet (SyncE)
over RJ45 port [2]
                 
Board Management                    
RJ45 1000BaseT SoC management port              
USB-C SoC management port              
MCTP over SMBus    
PLDM for Monitor and Control    
NCSI RBT        
Temperature and power sensors
Form Factor, Power, and Cooling                    
Height Half Full Full Full Full Full Full Full Full Full
Length Half Half Half Half Half Half 3/4 Half 3/4 3/4
Width Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot
Weight 204 g 317 g 350 g 350 g 340 g 340 g TBD TBD TBD TBD
Max. power dissipation
supported by platform [5]
55 W 58 W 75 W 120 W 120 W 120 W 150 W 150 W 150 W 150 W
Airflow (forward) requirement
at max power dissipation
>= 3.5 m/sw >= 2.5 m/s >= 2.5 m/s >= 2.5 m/s >= 3.5 m/s >= 3.5 m/s >= 4.0 m/s >= 6.5 m/s >= 5.6 m/s >= 5.6 m/s
Operating Environment                    
Temperature –5 °C to 55 °C (23 °F to 131 °F) -5 °C to 45 °C (23 °F to 113 °F)
Humidity 5% to 85%
Regulatory Approvals and Compliances                    
MTBF (hours) 991,182 398,565 398,565 398,565 593,730 593,730 519.049 TBD TBD TBD
Regulatory compliance
(common)
PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance
(product specific)
NEBS, KCC [7] NEBS, KCC [7] NEBS, KCC [7] NEBS, KCC [7] NEBS, KCC [7] KCC [7] KCC KCC KCC KCC

[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload.
Refer to the Napatech product/feature data sheets for actual power consumption.

[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech